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CP
NOTES
1. Mounting and cleaning conditions
for SMT type relays
1) Recommended re?ow condition is:
? Re?ow-soldering temperature pro?le
condition (IRS method)
T 3
T 2
T 1
2. Storage condition after opening a
moisture-prevention package
1) After opening a moisture-prevention
package, use the item as soon as
possible (within 3 days under an
environment of Max. 30 ° C 86 ° F , Max.
70% RH).
2) If products are not used within 4 days
after opening a moisture-prevention
package, store them in a humidity-
controlled desiccator or in a storage bag
t 1
t 2
with silica gel.
T 1 = 150 to 180 ° C 302 to 356 ° F
T 2 = 230 ° C 446 ° F or more
T 3 = Less than 260 ° C 500 ° F
t 1 = 60 to 120 sec.
t 2 = Less than 40 sec.
*1
? Cautions for mounting operations
Temperature pro?le indicates the
temperature of the soldered part (*1) of
terminals on the surface of a circuit
board. The exterior temperature of a relay
may be extremely high depending on the
component density on the board or the
heating method of the re?ow oven or
circuit board type. Suf?cient veri?cation
under actual processing conditions is
required.
2) Avoid cleaning (ultrasonic cleaning,
boiling cleaning, etc.) and coating in
order to prevent negative impacts on
relay characteristics.
For general cautions for use, please refer to the “CAUTIONS FOR USE OF AUTOMOTIVE RELAYS”
ASCTB225E 201301-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
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